The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2015
Filed:
Jan. 04, 2012
Chih-kai Kang, Tainan, TW;
Sheng-yuan Hsueh, Tainan, TW;
Shu-hsuan Chih, Kaohsiung, TW;
Po-kuang Hsieh, Kaohsiung, TW;
Chia-chen Sun, Kaohsiung, TW;
Po-cheng Huang, Chiayi, TW;
Shih-chieh Hsu, New Taipei, TW;
Chi-horn Pai, Tainan, TW;
Yao-chang Wang, Tainan, TW;
Jie-ning Yang, Ping-Tung County, TW;
Chi-sheng Tseng, Kaohsiung, TW;
Po-jui Liao, Taichung, TW;
Kuang-hung Huang, Tainan, TW;
Shih-chang Chang, Tainan, TW;
Chih-Kai Kang, Tainan, TW;
Sheng-Yuan Hsueh, Tainan, TW;
Shu-Hsuan Chih, Kaohsiung, TW;
Po-Kuang Hsieh, Kaohsiung, TW;
Chia-Chen Sun, Kaohsiung, TW;
Po-Cheng Huang, Chiayi, TW;
Shih-Chieh Hsu, New Taipei, TW;
Chi-Horn Pai, Tainan, TW;
Yao-Chang Wang, Tainan, TW;
Jie-Ning Yang, Ping-Tung County, TW;
Chi-Sheng Tseng, Kaohsiung, TW;
Po-Jui Liao, Taichung, TW;
Kuang-Hung Huang, Tainan, TW;
Shih-Chang Chang, Tainan, TW;
UNITED MICROELECTRONICS CORP., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
The present invention provides a structure of a resistor comprising: a substrate having an interfacial layer thereon; a resistor trench formed in the interfacial layer; at least a work function metal layer covering the surface of the resistor trench; at least two metal bulks located at two ends of the resistor trench and adjacent to the work function metal layer; and a filler formed between the two metal bulks inside the resistor trench, wherein the metal bulks are direct in contact with the filler.