The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2015
Filed:
Jan. 18, 2013
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Tsu-Hsiu Perng, Zhubei, TW;
Zhao-Cheng Chen, New Taipei, TW;
Chun-Hsiang Fan, Longtan Township, Taoyuan County, TW;
Ming-Huan Tsai, Zhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of semiconductor device fabrication includes forming a first dummy gate structure in a first region of a semiconductor substrate and forming a second dummy gate structure in a second region of the semiconductor substrate. A protective layer (e.g., oxide and/or silicon nitride hard mask) is formed on the second dummy gate structure. The first dummy gate structure is removed after forming the protective layer, thereby providing a first trench. A capping layer (e.g., silicon) is formed in the first trench. A metal gate structure may be formed on the capping layer. The protective layer may protect the second dummy gate structure during the removal of the first dummy gate structure.