The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2015

Filed:

Jun. 24, 2008
Applicants:

John J. Hautala, Beverly, MA (US);

Michael Graf, Belmont, MA (US);

Yan Shao, Andover, MA (US);

Brian S. Freer, Medford, MA (US);

Inventors:

John J. Hautala, Beverly, MA (US);

Michael Graf, Belmont, MA (US);

Yan Shao, Andover, MA (US);

Brian S. Freer, Medford, MA (US);

Assignee:

TEL Epion Inc., Billerica, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/48 (2006.01); H01J 27/02 (2006.01); C23C 14/10 (2006.01); C23C 14/22 (2006.01); H01J 27/00 (2006.01);
U.S. Cl.
CPC ...
C23C 14/48 (2013.01); C23C 14/10 (2013.01); C23C 14/221 (2013.01); H01J 27/026 (2013.01); H01J 2237/0812 (2013.01);
Abstract

A method of forming a thin film on a substrate is described. The method comprises providing a substrate in a reduced-pressure environment, and generating a gas cluster ion beam (GCIB) in the reduced-pressure environment from a pressurized gas mixture. A beam acceleration potential and a beam dose are set to achieve a thickness of the thin film ranging up to about 300 angstroms and to achieve a surface roughness of an upper surface of the thin film that is less than about 20 angstroms. The GCIB is accelerated according to the beam acceleration potential, and the accelerated GCIB is irradiated onto at least a portion of the substrate according to the beam dose. By doing so, the thin film is grown on the at least a portion of the substrate to achieve the thickness and the surface roughness.


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