The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Aug. 19, 2014
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Zhongping Cai, Fremont, CA (US);

Jingyi Xiong, Sunnyvale, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/01 (2006.01); G01N 21/13 (2006.01); G01N 21/95 (2006.01); G01B 11/14 (2006.01);
U.S. Cl.
CPC ...
G01N 21/13 (2013.01); G01B 11/14 (2013.01); G01N 21/9501 (2013.01); G01N 21/01 (2013.01); G01N 2021/135 (2013.01);
Abstract

High speed height control of a surface of a substrate within a wafer inspection system includes positioning a substrate on a substrate stage of a dynamically adjustable substrate stage assembly, actuating the substrate perpendicular to the surface of the substrate, measuring a height error value of the surface of the substrate at a position of inspection of the surface, measuring a displacement value perpendicular to the surface of the substrate at the location of the substrate stage assembly, generating a displacement target from the height error value and the displacement value, and adjusting an actuation state of the actuator using the measured height error value and the generated displacement target in order to maintain the substrate surface at an imaging plane of a detector of the inspection system or a focus of illumination of the inspection system.


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