The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9096428 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 04, 2015

Filed:

Mar. 08, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Tai-I Yang, Hsin-Chu, TW;

Ming-Tai Chung, Hsin-Chu, TW;

Hong-Seng Shue, Zhubei, TW;

Ming-Yi Lin, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00912 (2013.01); B81B 3/0075 (2013.01);
Abstract

Methods and apparatus for MEMS release are disclosed. A method is described including providing a substrate including at least one MEMS device supported by a sacrificial layer; performing an etch in solution to remove the sacrificial layer from at least one MEMS device; immersing the substrate including the at least one MEMS device in an organic solvent; and while the substrate is immersed in the organic solvent, removing water from the organic solvent until the water remaining in the organic solvent is less than a predetermined threshold. An apparatus is disclosed for performing the methods. Additional alternative methods are disclosed.


Find Patent Forward Citations

Yang, Tai-I. (2015). Methods and apparatus for mems structure release (U.S. Patent No. 9096428). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9096428

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