The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2015
Filed:
May. 06, 2013
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Vidhya Ramachandran, San Diego, CA (US);
Brian M. Henderson, Escondido, CA (US);
Shiqun Gu, San Diego, CA (US);
Chiew-Guan Tan, San Diego, CA (US);
Jung Pill Kim, San Diego, CA (US);
Taehyun Kim, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/66 (2006.01); H01L 23/498 (2006.01); H01L 29/861 (2006.01); H01L 23/60 (2006.01); H01L 25/065 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66128 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/60 (2013.01); H01L 25/0657 (2013.01); H01L 27/0255 (2013.01); H01L 27/0296 (2013.01); H01L 27/0694 (2013.01); H01L 29/8611 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/94 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12032 (2013.01);
Abstract
A method includes thinning a back-side of a substrate to expose a portion of a first via that is formed in the substrate. The method also includes forming a first diode at the back-side of the substrate. The first diode is coupled to the first via.