The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 2015

Filed:

Nov. 12, 2013
Applicant:

Xintec Inc., Jhongli, Taoyuan County, TW;

Inventors:

Baw-Ching Perng, Baoshan Township, TW;

Ying-Nan Wen, Hsinchu, TW;

Shu-Ming Chang, Tucheng Dist, TW;

Assignee:

XINTEC INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 25/00 (2006.01); B81C 1/00 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); B81C 1/0023 (2013.01); H01L 21/6835 (2013.01); H01L 24/94 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); B81B 2207/098 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0792 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01021 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16235 (2013.01);
Abstract

A chip package includes a substrate having an upper and a lower surface and including: at least a first contact pad; a non-optical sensor chip disposed overlying the upper surface, wherein the non-optical sensor chip includes at least a second contact pad and has a first length; a protective cap disposed overlying the non-optical sensor chip, wherein the protective cap has a second length, an extending direction of the second length is substantially parallel to that of the first length, and the second length is shorter than the first length; an IC chip disposed overlying the protective cap, wherein the IC chip includes at least a third contact pad and has a third length, and an extending direction of the third length is substantially parallel to that of the first length; and bonding wires forming electrical connections between the substrate, the non-optical sensor chip, and the IC chip.


Find Patent Forward Citations

Perng, Baw-Ching. (2015). Chip package and manufacturing method thereof (U.S. Patent No. 9093450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9093450

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…