The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Oct. 28, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Suresh D. Kadakia, Hopewell Junction, NY (US);
Kamal K. Sikka, Poughkeepsie, NY (US);
Hilton T. Toy, Hopewell Junction, NY (US);
Jeffrey A. Zitz, Poughkeepsie, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2006.01); H01L 21/50 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/50 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/433 (2013.01); H01L 23/4338 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A multi-chip electronic package and methods of manufacture are provided. The multi-chip package includes a plurality of chips mounted on a chip carrier. The multi-chip package further includes a lid mounted on the chip carrier using a bonding material or compression seal, and at least one single piston extending from the lid. Each piston covers an entirety of multiple chips of the plurality of chips.