The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2015
Filed:
Mar. 08, 2013
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Yu-Chih Huang, Hsin-Chu, TW;
Yen-Chang Hu, Tai-Chung, TW;
Ching-Wen Hsiao, Hsin-Chu, TW;
Chen-Shien Chen, Zhubei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Various embodiments of mechanisms for forming a die package and a package on package (PoP) structure using one or more compressive dielectric layers to reduce warpage are provided. The compressive dielectric layer(s) is part of a redistribution structure of the die package and its compressive stress reduces or eliminates bowing of the die package. In addition, the one or more compressive dielectric layers improve the adhesion between redistribution structure and the materials surrounding the semiconductor die. As a result, the yield and reliability of the die package and PoP structure using the die package are improved.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile