The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2015
Filed:
Aug. 10, 2012
Yoshirou Kuromitsu, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Nobuyuki Terasaki, Saitama, JP;
Toshio Sakamoto, Kitamoto, JP;
Kazunari Maki, Saitama, JP;
Hiroyuki Mori, Tsukuba, JP;
Isao Arai, Naka-gun, JP;
Yoshirou Kuromitsu, Saitama, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Nobuyuki Terasaki, Saitama, JP;
Toshio Sakamoto, Kitamoto, JP;
Kazunari Maki, Saitama, JP;
Hiroyuki Mori, Tsukuba, JP;
Isao Arai, Naka-gun, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.