The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Sep. 23, 2013
Applicant:

Varian Semiconductor Equipment Associates, Inc., Gloucester, MA (US);

Inventors:

William T. Levay, Rockport, MA (US);

George M. Gammel, Marblehead, MA (US);

Bon-Woong Koo, Andover, MA (US);

Brant S. Binns, Beverly, MA (US);

Richard M. White, Newmarket, NH (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 14/00 (2006.01); C23C 14/30 (2006.01); H05H 1/00 (2006.01); C23C 14/48 (2006.01); C23C 14/58 (2006.01); C23C 14/02 (2006.01); C23C 14/04 (2006.01); H01J 37/24 (2006.01); H01J 37/248 (2006.01); H01J 37/317 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 14/48 (2013.01); C23C 14/5826 (2013.01); C23C 14/021 (2013.01); C23C 14/048 (2013.01); C23C 14/022 (2013.01); H01L 2224/81913 (2013.01); H01J 37/241 (2013.01); H01J 37/243 (2013.01); H01J 37/248 (2013.01); H01J 37/3171 (2013.01); H01J 37/32412 (2013.01); H01J 37/32935 (2013.01); H01J 2237/0206 (2013.01); H01J 2237/24535 (2013.01);
Abstract

Methods of reducing glitch rates within an ion implanter are described. In one embodiment, a plasma-assisted conditioning is performed, wherein the bias voltage to the extraction electrodes is modified so as to inhibit the formation of an ion beam. The power supplied to the plasma generator in the ion source is increased, thereby creating a high density plasma, which is not extracted by the extraction electrodes. This plasma extends from the ion source chamber through the extraction aperture. Energetic ions then condition the extraction electrodes. In another embodiment, a plasma-assisted cleaning is performed. In this mode, the extraction electrodes are moved further from the ion source chamber, and a different source gas is used to create the plasma. In some embodiments, a combination of these modes is used to reduce glitches in the ion implanter.


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