The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Feb. 28, 2012
Applicants:
Daesik Choi, Seoul, KR;
Joonyoung Choi, Incheon, KR;
Yonghyuk Jeong, Kyungki-do, KR;
Inventors:
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 21/565 (2013.01); H01L 25/105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1082 (2013.01); H01L 2924/15311 (2013.01); H01L 2225/06558 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/32225 (2013.01); H01L 2225/06568 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01);
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a base integrated circuit over the base substrate; attaching a lead to the base integrated circuit and the base substrate, the lead having a lead attachment portion over the base integrated circuit; and forming a base encapsulation over the lead, the base encapsulation having a cavity exposing the lead attachment portion.