The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 2015
Filed:
Sep. 27, 2013
Christian Geissler, Teugn, DE;
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Andreas Augustin, Munich, DE;
Christian Mueller, Bottrop, DE;
Christian Geissler, Teugn, DE;
Thorsten Meyer, Regensburg, DE;
Gerald Ofner, Regensburg, DE;
Reinhard Mahnkopf, Oberhaching, DE;
Andreas Augustin, Munich, DE;
Christian Mueller, Bottrop, DE;
Intel Corporation, Santa Clara, CA (US);
Abstract
Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.