The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 2015

Filed:

Sep. 25, 2012
Applicants:

Kazuhiro Kubota, Miyagi, JP;

Masanobu Honda, Miyagi, JP;

Takayuki Katsunuma, Miyagi, JP;

Inventors:

Kazuhiro Kubota, Miyagi, JP;

Masanobu Honda, Miyagi, JP;

Takayuki Katsunuma, Miyagi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/66 (2006.01); H01J 37/32 (2006.01); H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); H01J 37/32449 (2013.01); H01J 37/32724 (2013.01); H01L 21/31116 (2013.01); H01L 21/76811 (2013.01); H01L 21/76813 (2013.01); H01L 2221/1015 (2013.01); H01L 21/31144 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A plasma etching method is provided for etching a substrate corresponding to an etching object within an etching apparatus that includes a supply condition adjustment unit for adjusting a supply condition for supplying etching gas to the substrate, a temperature adjustment unit for adjusting a temperature of the substrate placed on a stage along a radial direction, and a plasma generating unit for generating plasma within a space between the supply condition adjustment unit and the stage. The plasma etching method includes a control step in which the temperature adjustment unit controls the temperature of the substrate to be uniform within a substrate plane of the substrate, and an adjustment step in which the supply condition adjustment unit adjusts a concentration distribution of active species contained in the plasma generated by the plasma generation unit within the space above the substrate.


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