The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 2015
Filed:
Jun. 28, 2013
Omkar G. Karhade, Chandler, AZ (US);
Nevin Altunyurt, Chandler, AZ (US);
Kyu OH Lee, Chandler, AZ (US);
Krishna Bharath, Chandler, AZ (US);
Omkar G. Karhade, Chandler, AZ (US);
Nevin Altunyurt, Chandler, AZ (US);
Kyu Oh Lee, Chandler, AZ (US);
Krishna Bharath, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile