The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 19, 2015
Filed:
Mar. 12, 2013
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Ralf Otremba, Kaufbeuren, DE;
Guenther Lohmann, Ebenthal in Kaernten, AT;
Josef Hoeglauer, Kirchheim-Heimstetten, DE;
Teck Sim Lee, Melaka, MY;
Matteo-Alessandro Kutschak, Ludmannsdorf, AT;
Wolfgang Peinhopf, Viktring, AT;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49517 (2013.01); H01L 24/96 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 21/561 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/13062 (2013.01);
Abstract
Packaged chips comprising non-integer lead pitches, systems and methods for manufacturing packaged chips are disclosed. In one embodiment a packaged device includes a first chip, a package encapsulating the first chip and a plurality of leads protruding from the package, wherein the plurality of leads comprises differing non-integer multiple lead pitches.