The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2015

Filed:

May. 27, 2014
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Craig MacNaughton, Los Gatos, CA (US);

Sathish Veeraraghavan, Santa Clara, CA (US);

Pradeep Vukkadala, Fremont, CA (US);

Jaydeep Sinha, Livermore, CA (US);

Amir Azordegan, Santa Clara, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01J 37/317 (2006.01); H01J 37/28 (2006.01); H01J 37/304 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70633 (2013.01); H01J 37/3172 (2013.01); H01J 2237/30472 (2013.01); H01J 37/304 (2013.01); H01J 2237/30483 (2013.01); H01J 37/28 (2013.01); H01J 37/3174 (2013.01); H01J 2237/2814 (2013.01); H01J 2237/221 (2013.01);
Abstract

Systems and methods for providing improved scanner corrections are disclosed. Scanner corrections provided in accordance with the present disclosure may be referred to as wafer geometry aware scanner corrections. More specifically, wafer geometry and/or wafer shape signature information are utilized to improve scanner corrections. By removing the wafer geometry as one of the error sources that may affect the overlay accuracy, better scanner corrections can be obtained because one less contributing factor needs to be modeled.


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