The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2015
Filed:
Sep. 10, 2010
Applicants:
Jingbin Feng, Lake Oswego, OR (US);
R. Marshall Stowell, Wilsonville, OR (US);
Shantinath Ghongadi, Wilsonville, OR (US);
Zhian He, Tigard, OR (US);
Frederick Dean Wilmot, Gladstone, OR (US);
Inventors:
Jingbin Feng, Lake Oswego, OR (US);
R. Marshall Stowell, Wilsonville, OR (US);
Shantinath Ghongadi, Wilsonville, OR (US);
Zhian He, Tigard, OR (US);
Frederick Dean Wilmot, Gladstone, OR (US);
Assignee:
Novellus Systems, Inc., Fremont, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25B 9/02 (2006.01); C25D 17/00 (2006.01); C25D 17/10 (2006.01); C25D 7/12 (2006.01); C25D 17/06 (2006.01);
U.S. Cl.
CPC ...
C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 17/06 (2013.01); C25D 17/10 (2013.01);
Abstract
Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.