The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Mar. 25, 2011
Applicants:

Junjun Liu, Austin, TX (US);

Dorel I. Toma, Dripping Springs, TX (US);

Hongyu Yue, Plano, TX (US);

Inventors:

Junjun Liu, Austin, TX (US);

Dorel I. Toma, Dripping Springs, TX (US);

Hongyu Yue, Plano, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/40 (2006.01); H01L 21/67 (2006.01); B08B 7/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67028 (2013.01); B08B 7/0042 (2013.01); B08B 7/005 (2013.01); B08B 7/0057 (2013.01); H01L 21/67115 (2013.01); Y10S 430/145 (2013.01);
Abstract

A method for treating a dielectric film on a substrate and, in particular, a method for integrating a low-k dielectric film with subsequently formed metal interconnects is described. The method includes preparing a dielectric film on a substrate, wherein the dielectric film is a low-k dielectric film having a dielectric constant less than or equal to a value of about 4. Thereafter, the method further includes performing a preliminary curing process on the dielectric film, forming a pattern in the dielectric film using a lithographic process and an etching process, removing undesired residues from the substrate, and performing a final curing process on the dielectric film, wherein the final curing process includes irradiating the substrate with ultraviolet (UV) radiation.

Published as:
US2011237080A1; US2011232677A1; US2011233430A1; WO2011123373A1; TW201203362A; US8242460B2; KR20130014554A; JP2013528928A; TWI464805B; US9017933B2; JP2016167633A;

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