The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2015

Filed:

Feb. 17, 2011
Applicants:

Joel W. Pankow, Littleton, CO (US);

Gary J. Jorgensen, Pine, CO (US);

Kent M. Terwilliger, Lakewood, CO (US);

Stephen H. Glick, Evergreen, CO (US);

Nora Isomaki, Espoo, FI;

Kari Harkonen, Kauniainen, FI;

Tommy Turkulainen, Kirkkonummi, FI;

Inventors:

Joel W. Pankow, Littleton, CO (US);

Gary J. Jorgensen, Pine, CO (US);

Kent M. Terwilliger, Lakewood, CO (US);

Stephen H. Glick, Evergreen, CO (US);

Nora Isomaki, Espoo, FI;

Kari Harkonen, Kauniainen, FI;

Tommy Turkulainen, Kirkkonummi, FI;

Assignees:

Beneq Oy, Vantaa, FI;

U.S. Department of Energy, Washington, DC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 31/048 (2014.01); B32B 17/10 (2006.01); H01L 31/049 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0481 (2013.01); B32B 17/10018 (2013.01); B32B 2367/00 (2013.01); Y02E 10/50 (2013.01); H01L 31/049 (2013.01);
Abstract

A moisture barrier, device or product having a moisture barrier or a method of fabricating a moisture barrier having at least a polymer layer, and interfacial layer, and a barrier layer. The polymer layer may be fabricated from any suitable polymer including, but not limited to, fluoropolymers such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), or ethylene-tetrafluoroethylene (ETFE). The interfacial layer may be formed by atomic layer deposition (ALD). In embodiments featuring an ALD interfacial layer, the deposited interfacial substance may be, but is not limited to, AlO, AlSiO, TiO, and an AlO/TiOlaminate. The barrier layer associated with the interfacial layer may be deposited by plasma enhanced chemical vapor deposition (PECVD). The barrier layer may be a SiONfilm.


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