The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2015
Filed:
Mar. 04, 2009
Rajasekaran Swaminathan, Tempe, AZ (US);
Leonel Arana, Phoenix, AZ (US);
Yoshihiro Tomita, Ibaraki-ken, JP;
Yosuke Kanaoka, Ibaraki, JP;
Rajasekaran Swaminathan, Tempe, AZ (US);
Leonel Arana, Phoenix, AZ (US);
Yoshihiro Tomita, Ibaraki-ken, JP;
Yosuke Kanaoka, Ibaraki, JP;
Intel Corporation, Santa Clara, CA (US);
Abstract
Methods of forming a microelectronic packaging structure are described. Those methods may include forming a solder paste comprising a sacrificial polymer on a substrate, curing the solder paste below a reflow temperature of the solder to form a solid composite hybrid bump on the conductive pads, forming a molding compound around the solid composite hybrid bump, and reflowing the hybrid bump, wherein the sacrificial polymer is substantially decomposed.