The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2015

Filed:

May. 29, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Liang-Gi Yao, Hsinchu, TW;

Chun-Hu Cheng, Hsinchu, TW;

Chen-Yi Lee, Keelung, TW;

Jeff J. Xu, Jhubei, TW;

Clement Hsingjen Wann, Carmel, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8249 (2006.01); H01L 29/78 (2006.01); H01L 21/28 (2006.01); H01L 29/51 (2006.01); H01L 21/283 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78 (2013.01); H01L 21/28211 (2013.01); H01L 29/513 (2013.01); H01L 21/283 (2013.01);
Abstract

A method of performing an ultraviolet (UV) curing process on an interfacial layer over a semiconductor substrate, the method includes supplying a gas flow rate ranging from 10 standard cubic centimeters per minute (sccm) to 5 standard liters per minute (slm), wherein the gas comprises inert gas. The method further includes heating the interfacial layer at a temperature less than or equal to 700° C. Another method of performing an annealing process on an interfacial layer over a semiconductor substrate, the second method includes supplying a gas flow rate ranging from 10 sccm to 5 slm, wherein the gas comprises inert gas. The method further includes heating the interfacial layer at a temperature less than or equal to 600° C.


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