The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Jan. 06, 2012
Applicants:

Timothy H. Daubenspeck, Colchester, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Christopher D. Muzzy, Burlington, VT (US);

Wolfgang Sauter, Richmond, VT (US);

Jeffrey S. Zimmerman, Swanton, VT (US);

Inventors:

Timothy H. Daubenspeck, Colchester, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Christopher D. Muzzy, Burlington, VT (US);

Wolfgang Sauter, Richmond, VT (US);

Jeffrey S. Zimmerman, Swanton, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/3171 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05006 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/10122 (2013.01); H01L 2224/10126 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13022 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 23/3192 (2013.01);
Abstract

A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a dielectric material formed between a design sensitive structure and a passivation layer. The design sensitive structure comprising a lower wiring layer electrically and mechanically connected to a higher wiring level by a via farm. A method and structure is also provided.


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