The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2015

Filed:

Mar. 15, 2013
Applicant:

Air Products and Chemicals, Inc., Allentown, PA (US);

Inventors:

Xiaobo Shi, Chandler, AZ (US);

James Allen Schlueter, Phoenix, AZ (US);

Maitland Gary Graham, Phoenix, AZ (US);

Savka I. Stoeva, Chandler, AZ (US);

James Matthew Henry, Mesa, AZ (US);

Assignee:

Air Products and Chemicals, Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/306 (2006.01); C09G 1/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); C09G 1/02 (2013.01); H01L 21/31053 (2013.01);
Abstract

Chemical-mechanical polishing (CMP) compositions containing chemical additives and methods of using the CMP compositions are disclosed. The CMP composition comprises abrasive; chemical additive; liquid carrier; optionally an oxidizing agent; a pH buffering agent and salt; a surfactant and a biocide. The CMP compositions and the methods provide enhanced removing rate for 'SiC', SiN' and 'SiCN” films; and tunable removal selectivity for “SiC” in reference to SiO, “SiN” in reference to SiO, “SiC” in reference to “SiN”, or “SiCN” in reference to SiO; wherein x ranges from 0.1 wt % to 55 wt %, y ranges from 0.1 wt % to 32 wt %.


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