The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Sep. 16, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Martin Jay Seamons, San Jose, CA (US);

Sudha Rathi, San Jose, CA (US);

Kwangduk Douglas Lee, Redwood City, CA (US);

Deenesh Padhi, Sunnyvale, CA (US);

Bok Hoen Kim, San Jose, CA (US);

Chiu Chan, Foster City, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/64 (2006.01); C23C 16/02 (2006.01); C23C 16/26 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/64 (2013.01); C23C 16/0272 (2013.01); C23C 16/26 (2013.01); H01L 21/02115 (2013.01); H01L 21/02274 (2013.01); H01L 21/31144 (2013.01);
Abstract

Embodiments of the present invention generally relate to the fabrication of integrated circuits and particularly to the deposition of a boron containing amorphous carbon layer on a semiconductor substrate. In one embodiment, a boron-containing amorphous carbon film is disclosed. The boron-containing amorphous carbon film comprises from about 10 to 60 atomic percentage of boron, from about 20 to about 50 atomic percentage of carbon, and from about 10 to about 30 atomic percentage of hydrogen.


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