The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Nov. 02, 2012
Applicant:

Asml Netherlands N.v., Veldhoven, NL;

Inventors:

Xiuhong Wei, Eindhoven, NL;

Franciscus Godefridus Casper Bijnen, Valkenswaard, NL;

Richard Johannes Franciscus Van Haren, Waalre, NL;

Marcus Adrianus Van De Kerkhof, Helmond, NL;

Everhardus Cornelis Mos, Best, NL;

Hubertus Johannes Gertrudus Simons, Venlo, NL;

Remi Daniel Marie Edart, Eindhoven, NL;

David Deckers, Schilde, BE;

Nicole Schoumans, 's-Hertogenbosch, NL;

Irina Lyulina, Son, NL;

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01); G01B 11/27 (2006.01);
U.S. Cl.
CPC ...
G01B 11/272 (2013.01); G01B 11/27 (2013.01);
Abstract

A method is used to estimate a value representative for a level of alignment mark deformation on a processed substrate using an alignment system. The alignment sensor system is able to emit light at different measuring frequencies to reflect from an alignment mark on the substrate and to detect a diffraction pattern in the reflected light in order to measure an alignment position of the alignment mark. The two or more measuring frequencies are used to measure an alignment position deviation per alignment mark associated with each of the two or more measuring frequencies relative to an expected predetermined alignment position of the alignment mark. A value is determined representative for the spread in the determined alignment position deviations per alignment mark in order to estimate the level of alignment mark deformation.


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