The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Jun. 25, 2012
Chun-lei Hsu, Keelung, TW;
Chung-shi Liu, Hsin-Chu, TW;
De-yuan LU, Taipei, TW;
Ming-che Ho, Tainan, TW;
Yu-feng Chen, Hsin-Chu, TW;
Chun-Lei Hsu, Keelung, TW;
Chung-Shi Liu, Hsin-Chu, TW;
De-Yuan Lu, Taipei, TW;
Ming-Che Ho, Tainan, TW;
Yu-Feng Chen, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. In one embodiment, a PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal pillars are coupled to the first packaged die. The metal pillars have a first portion proximate the first packaged die and a second portion disposed over the first portion. Each of the metal pillars is coupled to a solder joint proximate the second packaged die.