The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Aug. 29, 2012
Applicants:

Stefan Cornelis Theodorus Van Der Sanden, Nijmegen, NL;

Richard Johannes Franciscus Van Haren, Waalre, NL;

Hubertus Johannes Gertrudus Simons, Venlo, NL;

Remi Daniel Marie Edart, Eindhoven, NL;

Xiuhong Wei, Eindhoven, NL;

Michael Kubis, Düsseldorf, DE;

Irina Lyulina, Son, NL;

Inventors:
Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 11/00 (2006.01); G03F 9/00 (2006.01); G03C 5/00 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70141 (2013.01); G03F 9/7003 (2013.01); G03F 9/7088 (2013.01); G03F 7/70633 (2013.01);
Abstract

A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.


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