The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Nov. 30, 2012
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Dmitri E. Nikonov, Beaverton, OR (US);

Robert L. Sankman, Phoenix, AZ (US);

Raseong Kim, Hillsboro, OR (US);

Jin Pan, Santa Clara, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); G06F 19/00 (2011.01); H05K 3/46 (2006.01); H05K 1/00 (2006.01); H01L 51/00 (2006.01); H01L 27/06 (2006.01); H01L 27/28 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 1/00 (2013.01); H01L 51/00 (2013.01); H01L 27/0688 (2013.01); H01L 51/0004 (2013.01); H01L 27/281 (2013.01);
Abstract

Three dimensional integrated circuits including semiconductive organic materials are described. In some embodiments, the three dimensional integrated circuits include one or more electronic components that include a semiconductive region formed of one or more semiconductive organic materials. The electronic components of the three dimensional integrated circuits may also include insulating regions formed from organic insulating materials, and conductive regions form from conductive materials. The three dimensional integrated circuits may be formed by an additive manufacturing process such as three dimensional printing. Apparatus and methods for producing and testing three dimensional integrated circuits are also described.


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