The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Jun. 04, 2010
Chad A. Mirkin, Wilmette, IL (US);
Wooyoung Shim, Skokie, IL (US);
Adam B. Braunschweig, New York, NY (US);
Xing Liao, Evanston, IL (US);
Jinan Chai, Spartanburg, SC (US);
Jong Kuk Lim, Gwangju, KR;
Gengfeng Zheng, Ambler, PA (US);
Zijian Zheng, Hong Kong, CN;
Chad A. Mirkin, Wilmette, IL (US);
Wooyoung Shim, Skokie, IL (US);
Adam B. Braunschweig, New York, NY (US);
Xing Liao, Evanston, IL (US);
Jinan Chai, Spartanburg, SC (US);
Jong Kuk Lim, Gwangju, KR;
Gengfeng Zheng, Ambler, PA (US);
Zijian Zheng, Hong Kong, CN;
Northwestern University, Evanston, IL (US);
Abstract
Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.