The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2015
Filed:
Jan. 10, 2013
Applicant:
Globalfoundries Singapore Pte. Ltd., Singapore, SG;
Inventors:
Fan Zhang, Singapore, SG;
Wei Shao, Singapore, SG;
Juan Boon Tan, Singapore, SG;
Yeow Kheng Lim, Singapore, SG;
Mahesh Bhatkar, Singapore, SG;
Soh Yun Siah, Singapore, SG;
Assignee:
GLOBALFOUNDRIES Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 23/5384 (2013.01); H01L 23/585 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device is disclosed. The semiconductor device includes a substrate comprises a plurality of metal layers. The semiconductor device also includes dielectric posts disposed in the metal layers. The density of the dielectric posts in the metal layers is equal to about 15-25%.