The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Aug. 13, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ralf Otremba, Kaufbeuren, DE;

Henrik Ewe, Burglengenfeld, DE;

Klaus Schiess, Allensbach, DE;

Manfred Mengel, Bad Abbach, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 23/36 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/5389 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 24/97 (2013.01); H01L 21/50 (2013.01); H01L 23/48 (2013.01); H01L 2224/18 (2013.01); H01L 2224/76155 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/82047 (2013.01); H01L 2224/92144 (2013.01); H01L 2224/97 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01087 (2013.01); H01L 2224/82102 (2013.01);
Abstract

One aspect is a device including a carrier comprising a first conducting layer, a first insulating layer over the first conducting layer, and at least one first through-connection from a first face of the first insulating layer to a second face of the first insulating layer. A semiconductor chip is attached to the carrier and a second insulating layer is over the carrier and the semiconductor chip. A metal layer is over the second insulating layer. A second through-connection is through the second insulating layer electrically coupling the semiconductor chip to the metal layer. A third through-connection is through the second insulating layer electrically coupling the carrier to the metal layer.


Find Patent Forward Citations

Loading…