The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Sep. 19, 2013
Hamza Yilmaz, Saratoga, CA (US);
Yueh-se Ho, Sunnyvale, CA (US);
Yan Xun Xue, Los Gatos, CA (US);
Jun LU, San Jose, CA (US);
Xiaotian Zhang, San Jose, CA (US);
Zhi Qiang Niu, Santa Clara, CA (US);
Ming-chen LU, Shanghai, CN;
Liang Zhao, Shanghai, CN;
Yuping Gong, Shanghai, CN;
Guofeng Lian, Shanghai, CN;
Hamza Yilmaz, Saratoga, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Yan Xun Xue, Los Gatos, CA (US);
Jun Lu, San Jose, CA (US);
Xiaotian Zhang, San Jose, CA (US);
Zhi Qiang Niu, Santa Clara, CA (US);
Ming-Chen Lu, Shanghai, CN;
Liang Zhao, Shanghai, CN;
YuPing Gong, Shanghai, CN;
GuoFeng Lian, Shanghai, CN;
Alpha & Omega Semiconductor, Inc., Sunnyvale, CA (US);
Abstract
The present invention discloses a stacked dual MOSFET package structure and a preparation method thereof. The stacked dual MOSFET package structure comprises a lead frame unit having a die paddle, a first lead and a second lead; a first chip flipped and attached on a top surface of a main paddle of the die paddle; a second chip attached on a bottom surface of the main paddle; and a metal clip mounted on the back of the flipped first chip and electrically connecting an electrode at the back of the first chip to the first lead. A top surface of a metal bump arranged on each electrode at the front of the second chip, a bottom surface of the die pin of the die paddle, a bottom surface of a lead pin of the second lead, and a bottom surface of the first lead are located on the same plane.