Shanghai, China

GuoFeng Lian


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: **Innovations of GuoFeng Lian: A Pioneer in Semiconductor Technology**

Introduction

GuoFeng Lian is a notable inventor based in Shanghai, China, known for his significant contributions to semiconductor technology. With a keen focus on innovation, Lian holds a patent that enhances the efficiency and functionality of semiconductor devices.

Latest Patents

Lian's patent, titled "Stacked Multi-Chip Bottom Source Semiconductor Device and Preparation Method Thereof," showcases his inventive prowess. This invention reveals a stacked dual MOSFET package structure, designed to improve the performance of semiconductor devices. The structure is ingeniously created, comprising a lead frame unit with a die paddle, a first lead, and a second lead. In this innovative design, a first chip is flipped and attached to the top surface of the main paddle, while a second chip is placed on the bottom surface. Key features include a metal clip that connects the electrodes of the first chip to the first lead, ensuring efficient electrical performance. The arrangement of various components also facilitates a concurrent plane for critical connections, enhancing overall device functionality.

Career Highlights

GuoFeng Lian is currently employed at Alpha & Omega Semiconductor Corporation, where he contributes to the advancement of semiconductor technology. His role involves collaboration on cutting-edge projects that push the boundaries of what is possible in the semiconductor industry.

Collaborations

Lian works alongside talented coworkers, including Hamza Yilmaz and Yueh-Se Ho, in a dynamic environment that fosters creativity and innovation. Together, they explore ways to enhance semiconductor devices, providing valuable contributions to the field.

Conclusion

In conclusion, GuoFeng Lian stands out as an influential inventor in the semiconductor arena. His patent for a stacked dual MOSFET package structure is a testament to his innovative spirit and commitment to advancements in technology. As he continues to collaborate with fellow experts at Alpha & Omega Semiconductor Corporation, the potential for future innovations remains promising.

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