The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Aug. 09, 2013
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventors:
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/49589 (2013.01); H01L 24/80 (2013.01); H05K 1/18 (2013.01); H01L 23/3107 (2013.01); H01L 23/49822 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01);
Abstract
A wiring board includes a substrate having a cavity, and an electronic component accommodated in the cavity of the substrate. The substrate has a thickness which is greater than a thickness of the electronic component such that a ratio of the thickness of the substrate to the thickness of the electronic component is set in a range of 0.3 or greater and 0.7 or less.