The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2015
Filed:
Jul. 03, 2013
Byung Tai DO, Singapore, SG;
Asri Yusof, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Linda Pei EE Chua, Singapore, SG;
Byung Tai Do, Singapore, SG;
Asri Yusof, Singapore, SG;
Arnel Senosa Trasporto, Singapore, SG;
Linda Pei Ee Chua, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a trench; mounting an integrated circuit device on the leadframe; forming a top encapsulation on the leadframe and the trench; forming a lead having a lead protrusion and a peripheral groove, the lead protrusion and the peripheral groove formed from etching the trench at a leadframe bottom side; and forming a bottom encapsulation surrounding a lead bottom side of the lead.