The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Apr. 17, 2012
Chia-chu Liu, Hsinchu, TW;
Kuei-shun Chen, Hsin-Chu, TW;
Chih-hsiung Peng, Miaoli County, TW;
Chi-kang Chang, New Taipei, TW;
Chiang Mu-chi, Hsinchu, TW;
Sheng-yu Chang, Hsinchu, TW;
Hua Feng Chen, Hsinchu, TW;
Chao-cheng Chen, Shin-Chu, TW;
Ryan Chia-jen Chen, Chiayi, TW;
Chia-Chu Liu, Hsinchu, TW;
Kuei-Shun Chen, Hsin-Chu, TW;
Chih-Hsiung Peng, Miaoli County, TW;
Chi-Kang Chang, New Taipei, TW;
Chiang Mu-Chi, Hsinchu, TW;
Sheng-Yu Chang, Hsinchu, TW;
Hua Feng Chen, Hsinchu, TW;
Chao-Cheng Chen, Shin-Chu, TW;
Ryan Chia-Jen Chen, Chiayi, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method for fabricating a device is disclosed. An exemplary method includes providing a substrate and forming a plurality of fins over the substrate. The method further includes forming a first opening in the substrate in a first longitudinal direction. The method further includes forming a second opening in the substrate in a second longitudinal direction. The first and second longitudinal directions are different. The method further includes depositing a filling material in the first and second openings.