The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2015

Filed:

Aug. 25, 2009
Applicants:

Masayuki Ishibashi, Tokyo, JP;

John F. Krueger, Albuquerque, NM (US);

Takayuki Dohi, Tokyo, JP;

Daizo Horie, Tokyo, JP;

Takashi Fujikawa, Tokyo, JP;

Inventors:

Masayuki Ishibashi, Tokyo, JP;

John F. Krueger, Albuquerque, NM (US);

Takayuki Dohi, Tokyo, JP;

Daizo Horie, Tokyo, JP;

Takashi Fujikawa, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); H01L 21/306 (2006.01); C30B 25/12 (2006.01); C23C 16/458 (2006.01); C30B 29/06 (2006.01); H01L 21/687 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C30B 25/12 (2013.01); C23C 16/4584 (2013.01); C23C 16/4585 (2013.01); C30B 29/06 (2013.01); H01L 21/68735 (2013.01); C23C 16/45519 (2013.01);
Abstract

A susceptor for use in an epitaxial growth apparatus and method where a plurality of circular through-holes are formed in the bottom wall of a pocket in an outer peripheral region a distance of up to about ½ the radius toward the center of the circular bottom wall. The total opening surface area of these through-holes is 0.05 to 55% of the surface area of the bottom wall. The opening surface area of each of the through-holes provided at this outer peripheral region is 0.2 to 3.2 mmand the density of the through-holes is 0.25 to 25 per cm. After a semiconductor wafer is mounted in the pocket, epitaxial growth is carried out while source gas and carrier gas (i.e., reactive gas) is made to flow on the upper surface side of the susceptor and carrier gas is made to flow on the lower surface side.


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