The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jan. 19, 2009
Applicants:

Shigeru Kasai, Nirasaki, JP;

Hiroyuki Miyashita, Nirasaki, JP;

Tomohiro Suzuki, Nirasaki, JP;

Masatake Yoneda, Nirasaki, JP;

Kazuhiro Ooya, Nirasaki, JP;

Inventors:

Shigeru Kasai, Nirasaki, JP;

Hiroyuki Miyashita, Nirasaki, JP;

Tomohiro Suzuki, Nirasaki, JP;

Masatake Yoneda, Nirasaki, JP;

Kazuhiro Ooya, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F27D 11/12 (2006.01); H01L 21/67 (2006.01); H01L 21/324 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/324 (2013.01); H01L 21/268 (2013.01);
Abstract

An annealing apparatus includes heating sources provided to face a wafer W, the heating sources having LEDs emitting lights to the wafer; light-transmitting members for transmitting the lights emitted from the LEDs; and cooling members made of aluminum and provided to directly contact with the heating sources, respectively. The heating sources include a plurality of LED arrays having supporters made of AlN, each having one surface on which the LEDs are adhered by using a silver paste; and other surface on which thermal diffusion members made of copper are adhered by using a solder. The LED arrays are fixed to the cooling member by using screws via a silicone grease.


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