The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 19, 2014

Filed:

Apr. 09, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hung-Ta Lin, Hsinchu, TW;

Chu-Yun Fu, Hsinchu, TW;

Shin-Yeh Huang, Hsinchu, TW;

Shu-Tine Yang, Jhubei, TW;

Hung-Ming Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A FinFET is described, the FinFET includes a substrate including a top surface and a first insulation region and a second insulation region over the substrate top surface comprising tapered top surfaces. The FinFET further includes a fin of the substrate extending above the substrate top surface between the first and second insulation regions, wherein the fin includes a recessed portion having a top surface lower than the tapered top surfaces of the first and second insulation regions, wherein the fin includes a non-recessed portion having a top surface higher than the tapered top surfaces. The FinFET further includes a gate stack over the non-recessed portion of the fin.


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