The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
Jul. 12, 2011
Kenichi Hara, Yamanashi, JP;
Mitsuaki Iwashita, Yamanashi, JP;
Takashi Tanaka, Yamanashi, JP;
Takayuki Toshima, Kumamoto, JP;
Takehiko Orii, Saga, JP;
Kenichi Hara, Yamanashi, JP;
Mitsuaki Iwashita, Yamanashi, JP;
Takashi Tanaka, Yamanashi, JP;
Takayuki Toshima, Kumamoto, JP;
Takehiko Orii, Saga, JP;
Tokyo Electron Limited, Tokyo, JP;
Abstract
A plated film having a uniform film thickness is formed on a surface of a substrate. A semiconductor manufacturing apparatus includes: a holding mechanism for holding a substrate rotatably; a nozzle for supplying a processing solution for performing a plating process on a processing target surface of the substrate; a substrate rotating mechanism for rotating the substrate held by the holding mechanism in a direction along the processing target surface; a nozzle driving mechanism for moving the nozzle in a direction along the processing target surface at a position facing the processing target surface of the substrate held by the holding mechanism; and a control unit for controlling the supply of the processing solution by the nozzle and the movement of the nozzle by the nozzle driving mechanism.