The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2014
Filed:
Dec. 02, 2009
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Zigmund Ramirez Camacho, Singapore, SG;
Henry Descalzo Bathan, Singapore, SG;
Jairus Legaspi Pisigan, Singapore, SG;
Stats Chippac Ltd., Singapore, SG;
Abstract
A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile