The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2014
Filed:
Aug. 16, 2011
Changqing Xie, Beijing, CN;
Nan Gao, Beijing, CN;
Yilei Hua, Beijing, CN;
Xiaoli Zhu, Beijing, CN;
Hailiang LI, Beijing, CN;
Lina Shi, Beijing, CN;
Dongmei LI, Beijing, CN;
Ming Liu, Beijing, CN;
Changqing Xie, Beijing, CN;
Nan Gao, Beijing, CN;
Yilei Hua, Beijing, CN;
Xiaoli Zhu, Beijing, CN;
Hailiang Li, Beijing, CN;
Lina Shi, Beijing, CN;
Dongmei Li, Beijing, CN;
Ming Liu, Beijing, CN;
Abstract
The present disclosure relates to the field of micro-nano fabrication, and provides a projection-type photolithography system using a composite photon sieve. The system comprises: a lighting system, a mask plate, a composite photon sieve and a substrate, which are arranged in order. The lighting system is adapted to generate incident light and irradiate the mask plate with the incident light. The mask plate is adapted to provide an object to be imaged by the composite photon sieve, and the incident light reaches the composite photon sieve after passing through the mask plate. The composite photon sieve is adapted to perform imaging, by which a pattern on the mask plate is imaged on the substrate. The substrate is adapted to receive an image of the pattern on the mask plate imaged by the composite photon sieve. According to the present disclosure, because the composite photon sieve is used instead of a projection objective lens in a conventional projection-type photolithography system, the advantage of high efficiency in the conventional projection-type photolithography system can be reserved, and also photolithography can be performed in batches rapidly, so that photolithography efficiency can be improved. Meanwhile, costs can be effectively cut down and the system can be reduced in size.