The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 20, 2014

Filed:

Oct. 18, 2011
Applicants:

Shang-yun Tu, Hsin-Chu, TW;

Yao-chun Chuang, Taipei, TW;

Ming Hung Tseng, Toufen Township, TW;

Chen-cheng Kuo, Chu-Pei, TW;

Chen-shien Chen, Zhubei, TW;

Inventors:

Shang-Yun Tu, Hsin-Chu, TW;

Yao-Chun Chuang, Taipei, TW;

Ming Hung Tseng, Toufen Township, TW;

Chen-Cheng Kuo, Chu-Pei, TW;

Chen-Shien Chen, Zhubei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the metal pad. A portion of the metal pillar overlaps a portion of the metal pad. A center of the metal pillar is misaligned with a center of the metal pad.


Find Patent Forward Citations

Tu, Shang-Yun. (2014). Connector structures of integrated circuits (U.S. Patent No. 8729699). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8729699

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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