The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 06, 2014
Filed:
May. 12, 2010
Francis Ko, Taichung, TW;
Chi-chun Hsieh, Tongluo Township, TW;
Shang-yun Hou, Jubei, TW;
Wen-chih Chiou, Miaoli, TW;
Shin-puu Jeng, Hsin-Chu, TW;
Chen-hua Yu, Hsin-Chu, TW;
Francis Ko, Taichung, TW;
Chi-Chun Hsieh, Tongluo Township, TW;
Shang-Yun Hou, Jubei, TW;
Wen-Chih Chiou, Miaoli, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A method of forming a device includes printing conductive patterns on a dielectric sheet to form a pre-ink-printed sheet, and bonding the pre-ink-printed sheet onto a side of a substrate. The conductive feature includes a through-substrate via extending from a first major side of the substrate to a second major side of the substrate opposite the first major side. A conductive paste is then applied to electrically couple conductive patterns to a conductive feature in the substrate.