The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 29, 2014

Filed:

Oct. 19, 2010
Applicants:

Yu-hsiang HU, Hsin-Chu, TW;

Chen-fa LU, Gangshan Township, TW;

Chung-shi Liu, Shin-Chu, TW;

Inventors:

Yu-Hsiang Hu, Hsin-Chu, TW;

Chen-Fa Lu, Gangshan Township, TW;

Chung-Shi Liu, Shin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); B32B 2310/0831 (2013.01);
Abstract

A method of forming an integrated circuit includes providing a wafer, and a tape adhered to the wafer, wherein the tape has a main surface perpendicular to a first direction. The tape is exposed to a light to cause the tape to lose adhesion. In the step of exposing the tape, the wafer and the tape are rotated, and/or the light is tilt projected onto the tape, wherein a main projecting direction of the light and the first direction form a tilt angle greater than zero degrees and less than 90 degrees.


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