The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
May. 31, 2012
Yi-lin Chuang, Taipei, TW;
Cheng-pin Chiu, Taoyuan, TW;
Ching-fang Chen, Taichung, TW;
Ji-jan Chen, Kaohsiung, TW;
Sandeep Kumar Goel, San Jose, CA (US);
Yun-han Lee, Baoshan Township, TW;
Charles C. C. Liu, Zhubei, TW;
Yi-Lin Chuang, Taipei, TW;
Cheng-Pin Chiu, Taoyuan, TW;
Ching-Fang Chen, Taichung, TW;
Ji-Jan Chen, Kaohsiung, TW;
Sandeep Kumar Goel, San Jose, CA (US);
Yun-Han Lee, Baoshan Township, TW;
Charles C. C. Liu, Zhubei, TW;
Taiwan Semiconductor Manufacturing Co. Ltd., Hsin-Chu, TW;
Abstract
The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs.