The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2014
Filed:
Jul. 15, 2010
Steven R. Lange, Alamo, CA (US);
Stephane Durant, Biarritz, FR;
Gregory L. Kirk, Pleasanton, CA (US);
Robert M. Danen, Pleasanton, CA (US);
Prashant Aji, San Jose, CA (US);
Steven R. Lange, Alamo, CA (US);
Stephane Durant, Biarritz, FR;
Gregory L. Kirk, Pleasanton, CA (US);
Robert M. Danen, Pleasanton, CA (US);
Prashant Aji, San Jose, CA (US);
KLA-Tencor Corporation, Milpitas, CA (US);
Abstract
A method for wafer defect inspection may include, but is not limited to: providing an inspection target; applying at least one defect inspection enhancement to the inspection target; illuminating the inspection target including the at least one inspection enhancement to generate one or more inspection signals associated with one or more features of the inspection target; detecting the inspection signals; and generating one or more inspection parameters from the inspection signals. An inspection target may include, but is not limited to: at least one inspection layer; and at least one inspection enhancement layer.