The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Nov. 21, 2012
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Chung-min Fu, Chungli, TW;
William Wu Shen, Hsinchu, TW;
Po-Hsiang Huang, Tainan, TW;
Meng-Fu You, Changhua, TW;
Chi-Yeh Yu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A computer implemented method comprises accessing a 3D-IC model stored in a tangible, non-transitory machine readable medium, inputting a power profile in a computer processor, generating a transient temperature profile based on the 3D-IC model, identifying a potential thermal violation at a corresponding operating time interval and a corresponding location of a plurality of points of the 3D-IC design, and outputting data representing the potential thermal violation. The 3D-IC model represents a 3D-IC design comprising a plurality of elements in a stack configuration. The power profile is applied to the plurality of elements of the 3D-IC design as a function of an operating time. The transient temperature profile includes temperatures at a plurality of points of the 3D-IC design as a function of an operating time.