The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 15, 2014
Filed:
Nov. 29, 2007
Eisuke Morisaki, Tsukui-Gun, JP;
Hirokatsu Kobayashi, Nirasaki, JP;
Jun Yoshikawa, Nirasaki, JP;
Ikuo Sawada, Nirasaki, JP;
Tsunenobu Kimoto, Kyoto, JP;
Noriaki Kawamoto, Kyoto, JP;
Masatoshi Aketa, Kyoto, JP;
Eisuke Morisaki, Tsukui-Gun, JP;
Hirokatsu Kobayashi, Nirasaki, JP;
Jun Yoshikawa, Nirasaki, JP;
Ikuo Sawada, Nirasaki, JP;
Tsunenobu Kimoto, Kyoto, JP;
Noriaki Kawamoto, Kyoto, JP;
Masatoshi Aketa, Kyoto, JP;
Tokyo Electron Limited, Tokyo, JP;
Rohm Co., Ltd., Kyoto-shi, JP;
Abstract
A disclosed film deposition apparatus includes a process chamber inside which a reduced pressure space is maintained; a gas supplying portion that supplies a film deposition gas to the process chamber; a substrate holding portion that is made of a material including carbon as a primary constituent and holds a substrate in the process chamber; a coil that is arranged outside the process chamber and inductively heats the substrate holding portion; and a thermal insulation member that covers the substrate holding portion and is arranged to be separated from the process chamber, wherein the reduced pressure space is separated into a film deposition gas supplying space to which the film deposition gas is supplied and a thermal insulation space defined between the substrate holding portion and the process chamber, and wherein a cooling medium is supplied to the thermal insulation space.